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連續沖模用材,如IC封裝、引線框架、端子、連接器、馬達芯片沖壓等
| 長度mm | 公差 | 寬度mm | 公差 | 厚度mm | 公差 | 平直度mm | 長度mm | 公差 | 寬度mm | 公差 | 厚度mm | 公差 | 平直度mm |
| 100 | 50/100 | 1.0-50.0 | 155 | 50/155 | 1.0-50.0 | ||||||||
| 105 | 50/105 | 1.0-50.0 | 160 | 50/160 | 1.0-50.0 | ||||||||
| 110 | 50/110 | 1.0-50.0 | 165 | 50/165 | 1.0-50.0 | ||||||||
| 115 | 50/115 | 1.0-50.0 | 170 | 50/170 | 1.0-50.0 | ||||||||
| 120 | 50/120 | 1.0-50.0 | 175 | 50/175 | 1.0-50.0 | ||||||||
| 125 | 50/125 | 1.0-50.0 | 180 | 50/180 | 1.0-50.0 | ||||||||
| 130 | 50/130 | 1.0-50.0 | 185 | 50/185 | 1.0-50.0 | ||||||||
| 135 | 50/135 | 1.0-50.0 | 190 | 50/190 | 1.0-50.0 | ||||||||
| 140 | 50/140 | 1.0-50.0 | 195 | 50/195 | 1.0-50.0 | ||||||||
| 145 | 50/145 | 1.0-50.0 | 200 | 50/200 | 1.0-50.0 | ||||||||
| 150 | 50/150 | 1.0-50.0 |
材種 | 材種名 | Co%(g/cm3) | WC晶粒度(g/cm3) | 比重(g/cm3) | 硬(HRA) | 抗折力(GPa) | K1C(m1/2) |
CU | |||||||
CU25 | 13 | 0.6 | 14.2 | 92.0 | 3.9 | 10.2 | |
CU35 | 15 | 0.6 | 14.0 | 91.5 | 3.9 | 10.6 | |
CU50 | 18 | 0.6 | 13.7 | 90.7 | 3.9 | 11.3 | |
CD | |||||||
CD10 | 10 | 1.0 | 14.5 | 91.5 | 3.6 | 10.4 | |
CD20 | 12.5 | 1.0 | 14.2 | 90.7 | 3.7 | 11.1 | |
CD30 | 15 | 1.0 | 14.0 | 90.0 | 3.8 | 11.9 | |
CG | |||||||
CG25 | 7 | 1.6 | 14.7 | 90.1 | 3.5 | 12.8 | |
CG35 | 9 | 1.6 | 14.5 | 89.2 | 3.6 | 14.1 | |
CG50 | 12 | 1.6 | 14.3 | 88.2 | 3.7 | 15.3 | |
CG65 | 15 | 1.6 | 14.0 | 87.0 | 3.4 | 17.0 | |
CG80 | 18 | 1.6 | 13.6 | 86.0 | 3.5 | 18.7 | |
CT | CT40 | 12 | 2.4 | 14.2 | 87.0 | 3.4 | 21.0 |
CT55 | 15 | 2.4 | 13.9 | 86.0 | 3.2 | 22.1 | |
CT70 | 18 | 2.4 | 13.6 | 85.0 | 2.9 | 23.2 | |
CT80 | 20 | 2.4 | 13.4 | 84.0 | 2.6 | 24.0 | |
CT90 | 22 | 2.4 | 13.2 | 83.0 | 2.1 | 24.7 | |
CT95 | 25 | 2.4 | 13.0 | 82.0 | 3.4 | 25.5 | |
CM | CM20 | 6 | 1.6 | 14.9 | 90.2 | 3.4 | 15.0 |
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